77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Industries · Applications
PCB & PCBA for AI & HPC
PCB and PCBA for computing and accelerator hardware that needs high-layer, low-loss boards.
Applications
What AI & HPC projects need
AI and HPC hardware often combines low-loss materials, controlled impedance, high layer counts and back drilling. Stack-ups are reviewed per design. This describes typical requirements and is not a customer reference.
- Low-loss materials
- Controlled impedance
- High layer count stack-ups
- Back drilling
Typical applications and certificates
| Positioning | High-Speed / High-Layer |
|---|---|
| Typical applications | AI Servers, GPU Accelerator Cards, HPC |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Typical computing modules
Typical requirements from the ShinePCB application capability sheet. Each project is reviewed against its own drawing and specification.
| End product / typical modules | Applicable PCB types | Key processes | Material direction | Engineering focus |
|---|---|---|---|---|
| AI servers / GPU accelerator cards / HPC — main board, switch board, high-speed interconnect, power | High-layer-count, backplane, HDI, high-speed, heavy copper | High layer count; back drilling; impedance; sequential lamination; POFV; heavy copper | MEGTRON 6/7/8, Tachyon 100G, TU-933 | 112G/224G insertion loss; registration; warpage; power delivery |
Application descriptions show typical board requirements. They are not customer references, and end-product standards remain the responsibility of the product owner. Signal-integrity and IPC class requirements follow the customer specification.
Low-loss laminates
| Material | Series | Tg | Dk | Df | Typical use |
|---|---|---|---|---|---|
| Panasonic MEGTRON 6 | High-speed digital | 185 °C | 3.34 @ 13 GHz | 0.0037 | High-speed multilayer |
| Panasonic MEGTRON 7 R-5785(N) | High-speed digital | 200 °C | 3.31 @ 14 GHz | 0.0023 | High-speed multilayer; backplane |
| Panasonic MEGTRON 8 R-5795(N) | Ultra-high-speed digital | 220 °C | 3.13 @ 14 GHz | 0.0016 | High-speed multilayer; backplane |
| Panasonic MEGTRON 8 R-5795(U) | Ultra-high-speed digital | 220 °C | 3.08 @ 14 GHz | 0.0012 | High-speed multilayer; backplane |
| Panasonic XPEDION 1 R-5515X | Low-loss epoxy | 170 °C | 3.06 @ 14 GHz | 0.0021 | High-speed multilayer |
| TUC TU-872SLK / TU-933 | High-speed low-loss | — | — | — | High-speed multilayer; backplane |
| Ventec VT-770 / VT-770LK | High-speed digital | — | 3.18–3.41 @ 10 GHz | 0.0039–0.0045 | High-speed digital (varies with construction) |
| Shengyi Synamic 6 / 6N / 6GX | High-speed digital | — | 3.35–3.73 | 0.0021–0.005 | High-speed digital |
| Nelco N4000-13 series | High-speed low-loss | — | — | — | High-speed backplane and multilayer |
Source: ShinePCB capability workbook, material sheet. Dk, Df and Tg are typical supplier datasheet values (test frequency shown where the source lists it). They describe the laminate, not the finished board. Grades are available on request and confirmed with availability during engineering review. "—" means no value is listed in the source.
Selected builds
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical products
Accelerator and GPU boards
Server motherboards
High-speed interconnect cards
AI & HPC FAQs
Can you build high-layer server boards?
Layer count and construction are confirmed in engineering review.
Which materials are suitable?
Low-loss options are reviewed against your signal requirements.
